加入收藏  设为首页
 
Home | 中文  
   Home   |   About Journal   |   Editorial Board   |   Instruction   |   Rewarded   |   Indexed-in   |   Impect Factor   |   Subscriptions   |   Contacts Us
SPECTROSCOPY AND SPECTRAL ANALYSIS  2013, Vol. 33 Issue (03): 647-652    DOI: TQ433.4
光谱学与光谱分析 |
The Curing Behavior of Two Thermoset Resins Containing Silicon Alkynyl Group
SHI Song1, KONG Lei2*, QI Hui-min3, ZHANG Da-hai2
1. Tianjin Polytechnic University, School of Materials Science and Engineering, Tianjin 300160, China
2. Aerospace Research Institute of Materials & Processing Technology, Science and Technology on Advanced Functional Composites Laboratory, Beijing 100076, China
3. School of Materials Science and Engineering, East China University of Science and Technology, Shanghai 200237, China