Study on the Compositions in the Interface of Corrosion Inhibition Membrane／Copper Plating Layer／Iron Substrate by Depth Etching and Photoelectron Spectroscopy
FENG Shao-bin1, SHANG Shi-bo2, FENG Li-ting1, LIU Qing1，ZHANG Jing-wei3, LI Zong-hui3
1. Zhengzhou Institute of Light Industry, Zhengzhou 450002, China 2. CITIC Guoan Mengguli Power Source Technology Co. Ltd., Beijing 102200, China 3. Special Functional Material Laboratory, Henan University, Kaifeng 475001, China
Abstract：In order to explore the reason for the weak bond intensity between pyro-phosphate copper plating layer and iron substrate, spectrum technology was adopted. The compositions of various elements in the perpendicular interface were analyzed. The effect of surface roughness in the metal substrate on various elements distribution was discussed. According to etching time, the membrane layer was divided into three portions: surface layer with nitrogen and oxygen content decreasing quickly, mesosphere of basic fixed composition, and mix disturbing layer with substrate element appearing and occupying a half thickness. Through analyzing oxygen content in the mix layer, it was concluded that the oxygen layer in the interface of copper layer／iron substrate was the main cause of influencing the bond intensity between the plating layer and substrate.
冯绍彬1，商士波1，2，冯丽婷1，刘 清1，张经纬3，李宗慧3 . 采用深度刻蚀与XPS能谱研究缓蚀膜／镀铜层／铁基体界面成分[J]. 光谱学与光谱分析, 2006, 26(01): 166-169.
FENG Shao-bin1, SHANG Shi-bo2, FENG Li-ting1, LIU Qing1，ZHANG Jing-wei3, LI Zong-hui3 . Study on the Compositions in the Interface of Corrosion Inhibition Membrane／Copper Plating Layer／Iron Substrate by Depth Etching and Photoelectron Spectroscopy . SPECTROSCOPY AND SPECTRAL ANALYSIS, 2006, 26(01): 166-169.
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