Research Progress of Spectral Measurement on the On-Line Monitoring of Laser Processing
HU Guo-qing1, 2, GUAN Ying-chun1, 2, 3*
1. School of Mechanical Engineering and Automation, Beihang University, Beijing 100191, China
2. Hefei Innovation Research Institute of Beihang University, Hefei 230012, China
3. National Engineering Laboratory of Additive Manufacturing for Large Metallic Components, Beihang University, Beijing 100191, China
Abstract：With the development of modern industrial applications, laser processing requirements with complex processing environments and objects, large dynamic range, high efficiency, and high precision are becoming more and more urgent. And the on-line monitoring and real-time optimization of laser processing parameters is an important solution. At the same time, a variety of optical signals and changes in surface optical properties can be generated during the interaction between laser and material. They are closely related to processing parameters, processes, and target properties. Therefore, spectral measurements of corresponding optical signals could reveal the machining process and status, indicating an important on-line monitoring means of laser processing. Spectral measurements with the characteristics of high resolution and rich spectral information have been used for almost all laser processing processes, including laser welding, laser cutting and drilling, laser cleaning and polishing, micro-nano structure preparation, and additive manufacturing. This paper analyzes and summarizes the spectral measurement techniques, including plasma spectroscopy, reflection spectroscopy, and nonlinear optical spectroscopy, applied in on-line monitoring of laser machining. Based on the spectral measurement of plasma signals excited during single and multiple-pulse processing, the qualitative and quantitative monitoring of chemical composition during laser processing can be achieved. In addition, laser focus can be adjusted in real-time according to the relative intensity variances of characteristic peaks. The laser processing processes related to thermal effect can also be monitored and regulated based upon the plasma temperature. As a non-destructive monitoring method over a relatively long distance, reflection spectroscopy can effectively monitor the cleanliness, damages, chroma, and compositional changes of the material surface by measuring the integral spectral power of the reflected light signal a specific band, position and intensity of characteristic spectral peaks and bands. The nonlinear optical signals excited under certain conditions, including the harmonic signals, the fluorescence signals, and the Raman signals, can also provide additional methods of spectral measurements. Although their application scenarios are limited, they provide a new monitoring method for component analysis, focus, and material damage. Furthermore, the future development trend of spectral measurement, including the collaborative monitoring of multiple optical signals, the combined monitoring of spectral, acoustical, temperature and image signals in on-line monitoring of laser processing, has prospected. Meanwhile, the combination of artificial intelligence technology, on-line monitoring and laser processing will further promote the intelligent development of laser processing technology.
Key words：Spectral measurement；Laser processing；On-line monitoring；Research process
胡国庆，管迎春. 光谱测量在激光加工在线监测上的应用研究进展[J]. 光谱学与光谱分析, 2021, 41(08): 2343-2356.
HU Guo-qing, GUAN Ying-chun. Research Progress of Spectral Measurement on the On-Line Monitoring of Laser Processing. SPECTROSCOPY AND SPECTRAL ANALYSIS, 2021, 41(08): 2343-2356.
[1] Maiman T H. The Laser Inventor: Memoirs of Theodore H. Maiman, Springer International Publishing, 2018.
[2] Strickland D. Rev. Mod. Phys., 2019, 91(3)：7.
[3] Goodno G D, Komine H, McNaught S J, et al. Opt. Lett., 2006, 31(9): 1247.
[4] Quazi M M, Ishak M, Fazal M A, et al. Opt. Laser Technol., 2020, 126: 36.
[5] Wang H P, Feng W H, Zhang Z, et al. J. Laser Appl., 2019, 31(4): 6.
[6] Nisar S, Li L, Sheikh M A. J. Laser Appl., 2013, 25(4): 11.
[7] Gautam G D, Pandey A K. Opt. Laser Technol., 2018, 100: 183.
[8] Ukar E, Lamikiz A, Liébana F, et al. Materialwissenschaft Und Werkstofftechnik, 2015, 46(7): 661.
[9] Wang Q, Morrow J D, Ma C, et al. J. Manuf. Processes, 2015, 20(1): 340.
[10] Siano S, Salimbeni R. Accounts Chem. Res., 2010, 43(6)：739.
[11] Hu G Q, Guan K, Lu L B, et al. Engineering, 2018, 4(6): 822.
[12] Wang H P, He M J, Liu H, et al. ACS Appl. Mater. Interfaces, 2019, 11(28): 25586.
[13] Kadirgama K, Harun W S W, Tarlochan F, et al. Int. J. Adv. Manuf. Technol., 2018, 97(1-4): 495.
[14] Sony S, Laventure S, Sadhu A, et al. Journal of Structural Control and Health Monitoring, 2019, 26(3): 22.
[15] Huang H, Yang L M, Bai S, et al. Journal of Biomedical Optics, 2015, 20(2): 7.
[16] DING Ye, XUE Yao, PANG Ji-hong, et al(丁 烨, 薛 遥, 庞继红, 等). Sci. Sin. Physica, Mechanica Astron.(中国科学: 物理学 力学 天文学), 2019，49: 60.
[17] Skruibis J, Balachninaite O, Butkus S, et al. Opt. Laser Tech., 2019, 111: 295.
[18] Hu G Q, Song Y, Zheng Z, et al. Femtosecond Laser Bone Drilling With the Second-Harmonic-Generation Green Positioning and On-Line Spectral Monitoring, Frontiers in Optics+Laser Science, 2019: JTu4A：92.
[19] Moretti P, Iwanicka M, Melessanaki K, et al. Herit. Sci., 2019, 7: 44.
[20] Allen F I, Kim E, Andresen N C, et al. Ultramicroscopy, 2017, 178: 33.
[21] Lee J M, Watkins K G, Steen W M. J. Laser Appl., 2001, 13(1): 19.
[22] Lee J M, Watkins K G, Steen W M. ICALEO 2000, 2000, E232: doi: 10.2351/1.5059500.
[23] Lee J M, Steen W M. Int. J. Adv. Manuf. Technol., 2001, 17(4): 281.
[24] Marimuthu S, Kamara A M, Whitehead D, et al. Opt. Laser Tech., 2010, 42(8): 1233.
[25] Orzi D J O, Alvira F C, Bilmes G M. Appl. Phys. A, 2013, 110：735.
[26] Gu H, Mueller R E, Duley W W. Proc. SPIE, 1996, 2703: 80.
[27] Hong M H, Lu Y F, Song W D, et al. Proc. SPIE, 1997, 3184: 148.
[28] Marshall G J H, Young W J, Thompson S M, et al. JOM, 2016, 68(3): 778.
[29] Akira K, Mitsuo K, Ichiro N. JSME Int. J. Ser. A, Mech. Material Eng.，1995, 38(2): 249.
[30] Lu Y F, Hong M H, Chua S J, et al. J. Appl. Phys., 1996, 79(5): 2186.
[31] Schanwald L P. Met. Powder Rep., 1997, 52(10): 87125-1.
[32] Cabalín L M, Laserna J J. Spectrochimica Acta Part B: Atomic Spectroscopy, 1998, 53(5): 723.
[33] Connolly J O, Beirne G J, O’Connor G M, et al. Proc. SPIE, 2000, 3935: 132.
[34] Hong M H, Lu Y F, Chong T C. Proc. SPIE, 2002, 4426: 51.
[35] Deng Y Z, Zheng H Y, Murukeshan V M, et al. J. Laser Micro Nanoeng., 2006, 1(2): 136.
[36] Diego-Vallejo D, Ashkenasi D, Eichler H J. Phys. Procedia, 2013, 41: 904.
[37] Dietz N, Sukidi N, Harris C, et al. J. Vac. Sci. Technol. A, 1997, 15(3): 807.
[38] Semmar N, Tebib M, Tesar J, et al. Appl. Surf. Sci., 2008, 255(10): 5549.
[39] Verhoff B, Harilal S S, Freeman J R, et al. J. Appl. Phys., 2012, 112(9): 093303.
[40] Vadillo J M, Laserna J J. Spectrochimica Acta Part B: Atomic Spectroscopy, 2004, 59(2): 147.
[41] Kong F, Ma J, Carlson B, et al. Opt. Laser Tech., 2012, 44(7): 2186.
[42] Deguchi Y, Noda M, Fukuda Y, et al. Meas. Sci. Technol., 2002, 13(10): R103.
[43] LIU Yang, ZHAO Tian-zhuo, YU Jin, et al(刘 洋, 赵天卓, 余 锦, 等), Spectroscopy and Spectral Analysis(光谱学与光谱分析), 2019, 39(1): 263.
[44] Vadillo José M, Vadillo I, Carrasco F, et al. Fresenius J. Anal. Chem., 1998, 361: 119.
[45] Margetic V, Bolshov M, Stockhaus A, et al. J. Anal. At. Spectrom., 2001, 16(6): 616.
[46] Romero D, Laserna J J. Spectrochimica Acta Part B: Atomic Spectroscopy, 2000, 55(8): 1241.
[47] Sibillano T, Rizzi D, Mezzapesa F P, et al. Sensors, 2012, 12(8): 11077.
[48] Wang S Y, Wang Y C, Liu C S, et al. Sci. Rep., 2020, 10: 4241.
[49] Ahamer C M, Pedarnig J D. Spectrochimica Acta Part B: Atomic Spectroscopy, 2018, 148: 23.
[50] Song L, Huang W, Han X, et al. IEEE Trans. Ind. Electron., 2017, 64(1): 633.
[51] Song L J, Mazumder J. IEEE Sens. J., 2012, 12(5): 958.
[52] Fox M D T, French P, Peters C, et al. Applied Optics, 2002, 41(24): 4988.
[53] Tong Y Q, Zhang A, Fu Y H, et al. Spectr. Anal., 2019, 39(8): 2388.
[54] Abbasi H, Rauter G, Guzman R, et al. J. Biomed. Opt., 2018, 23(7): 1.
[55] Deng Y Z, Zheng H Y, Murukeshan V M, et al. International Journal of Nanoscience, 2005, 4(4): 761.
[56] Ricciardi G, Cantello M, Mariotti F, et al. CIRP Annals-Manuf. Tech., 1999, 48(1): 159.
[57] Whitehead D J, Crouse P L, Schmidt M J J, et al. Appl. Phys. A, 2008, 93(1): 123.
[58] Song Y, Hu G, Zhang Z, et al. Opt. Lasers Eng., 2020, 128: 106017.
[59] Gao J Q, Qin G L, Yang J L, et al. China Welding, 2011, 20(3): 67.
[60] Papanikolaou A, Tserevelakis G J, Melessanaki K, et al. Opto-Electron. Adv., 2020, 3(2): 11.
[61] Meng W, Yin X, Fang J, et al. Opt. Lasers Eng., 2019, 109: 168.
[62] Barletta M, Gisario A. Surf. Coat. Technol., 2006, 200(24): 6678.
[63] Ye D, Hong G S, Zhang Y, et al. Int. J. Adv. Manuf. Tech., 2018, 96(5-8): 2791.
[64] Akbari M, Saedodin S, Panjehpour A, et al. Optik, 2016, 127(23): 11161.
[65] Luo M S Y, Shin Y. Int. J. Adv. Manuf. Technol., 2015, 81(1-4): 263.
