Research on the Atomic Emission Spectroscopy of Atmospheric Pressure Plasma Process
JIN Jiang1, LI Na1, XU Lu2, WANG Bo1*, JIN Hui-liang1
1. Center for Precision Engineering, Harbin Institute of Technology, Harbin 150001, China 2. Shenyang Aeroengine Science Co., Ltd., Shenyang 110043, China
Abstract:In the reaction of the atmospheric pressure plasma process, the heat stable process of the atmospheric pressure plasma jet has a direct impact on the removal rate, CF4 is the provider of active F* atom, O2 is important auxiliary gas, and they play an important role in the process. In order to research the rule of the concentration of the 3 parameters upon the atmospheric pressure plasma processing, the atmospheric pressure plasma jet was used for processing and the spectrometer was used to monitor the changes in the process. The experiment indicates that: when the heat is stable, the concentration of the active F* atom essentially remains unchanged; with increasing the concentration of gas CF4, the spectrum of the active F* atom has self-absorption phenomena, so using the atomic emission spectroscopy method to monitor the changes in the concentration of active F* atom generated by CF4 is not completely exact; because O2 can easily react with the dissociation product of CF4, which inhibits the compound of the active F* atom, so in a certain range with increasing the concentration of gas O2, the concentration of the active F* atom becomes strong.
金 江1,李 娜1,徐 录2,王 波1*,金会良1 . 大气等离子体加工过程的原子发射光谱研究[J]. 光谱学与光谱分析, 2013, 33(02): 535-539.
JIN Jiang1, LI Na1, XU Lu2, WANG Bo1*, JIN Hui-liang1 . Research on the Atomic Emission Spectroscopy of Atmospheric Pressure Plasma Process. SPECTROSCOPY AND SPECTRAL ANALYSIS, 2013, 33(02): 535-539.
[1] Andreas Schutze, James Y Jeong, Steven E Babayan, et al. IEEE Transactions on Plasma Science, 1998, 26(6): 1685. [2] ZHAO Qing, LIU Shu-zhang, TONG Hong-hui(赵 青,刘述章,童洪辉). Plasma Technology and Its Applications(等离子体技术及应用). Beijing: National Defense Industry Press(北京:国防工业出版社), 2009. 320. [3] YU Zhe, ZHANG Zhi-tao, ZHAO Jian-sen(俞 哲,张芝涛,赵建森). Physics Experimentation(物理实验), 2010, 30(1): 1. [4] WANG Hui-hui, LI Hong, YOU Wei, et al(王慧慧,李 弘,尤 玮, 等). Journal of University of Science and Technology of China(中国科学技术大学学报), 2011, 41(1): 82. [5] LI Min-zan(李民赞). Spectrometry Technology and Application(光谱分析技术及其应用). Beijing: Science Press(北京:科学出版社), 2006. 20. [6] Rami Ben Gadria, Roth J Reece, Thomas C Montie,et al. Surface and Coatings Technology, 2000, 131: 528. [7] William John O’Brien. The Characterisation and Material Removal Properties of the Reactive Atom Plasma (RAPTM) Process. PhD Thesis of Cranfield University, 2010. 154. [8] Yamamura K, Shimada S, Mori Y. CIRP Annals-Manufacturing Technology, 2008, 57: 567. [9] ZHENG Guo-jing, JI Zi-hua, YU xing(郑国经,计子华,余 兴). Atomic Emission Spectrometry Technology and Application(原子发射光谱分析技术及应用). Beijing: Chemical Industry Press(北京:化学工业出版社), 2010. 33. [10] Baldur Eliasson, Ulrich Kogelschatz. IEEE Transactions on Plasma Science, 1991, 19(6): 1063.