Abstract:A strong complex agent is normally used in the alkaline chemical plating solution for Ni-P plating in order to prevent Ni ion from precipitation by hydrolysis. To keep a stable pH condition, an NH3-NH4Cl buffer system is used. Traditionally, it is considered that NH3 does not participate in the complex because of the relatively low Ni-NH3 complexing constant,but some experimental results cannot be explained reasonably. Touhami etc. have proposed a ternary Ni-citrate-NH3 complex involved in the discharge process,however they cannot give the direct support on the presence of this complex in solution. In this paper, a UV-Vis spectrometric study was carried out to identify the nickel complex in the Ni-P plating solution, and the results indicated the presence of both Ni-cit binary complex and Ni-cit-ammonia ternary complex. After the systematic investigation of the dependence of UV-Vis spectra on the two ligands (cit and ammonia), the composition of this Ni-cit-ammonia ternary complex was supposed to be Ni(Ⅱ)(C6H5O3-7)(NH3)3.
王徐承,蔡文斌,王卫江,柳厚田* . UV-Vis光谱法表征化学镀Ni-P合金镀液中活性配合物组成 [J]. 光谱学与光谱分析, 2004, 24(07): 837-840.
WANG Xu-cheng, CAI Wen-bin, WANG Wei-jiang, LIU Hou-tian* . UV-Vis Spectrometric Characterization of the Composition of Active Complex in the Ni-P Plating Solution . SPECTROSCOPY AND SPECTRAL ANALYSIS, 2004, 24(07): 837-840.
[1] JIANG Xiao-xia, SHEN Wei(姜晓霞, 沈 伟著). Theory and Practice of Chemistry Plating(化学镀理论与实践). Beijing: National Defence Press(北京:国防工业出版社), 2000. 1. [2] Lee Sheng-Long,Liang Han-His,Plating & Surface Finishing,1991,78(9):82. [3] Wang Y,Geng C H,Deng Z H. Plating & Surface Finishing,1992,79(3):57. [4] Lee Sheng-Long,Liang Han-His. Plating & Surface Finishing,1992,79(2):56. [5] Lu Guojin,Zangari Giovanni. Electrochimica Acta,2002,47:2969. [6] Lu Guojin,Zangari G. The 199<sup>th</sup> Electrochemical Society Meetings. Meeting Abstracts, Washington DC, 2001. Abstract 31. [7] Touhami Ebn M,Cherkaoui M et al. Journal of Applied Electrochemistry,1996,26:487. [8] Touhami Ebn M,Chassaing E,Cherkaoui M. Electrochimica Acta,1998,43:1721. [9] Abrantes L M,Correia J P. J. Electrochem. Soc.,1994,141:2356. [10] Younes O,Gileadi E. J. Electrochem. Soc.,2002,149:C100. [11] Mallory G O,Hajdu J B. Electroless Plating. Sponsored and Published by AESF. Orlando Florida, 1990,30.